Low profile package and low inductance.
Excellent clamping capability.
200W Peak Pulse power capability at 10×1000μs waveform.
Typical IR less than 1μA above 10V.
Fast response time: typically less than 1.0ps from 0V to VBR min.
High temperature reflow soldering: 260°C/40s at terminals.
Plastic package has underwriters laboratory flammability 94V-0.
Meets MSL level 1, per J-STD020.
For surface mounted applications in order to optimize board space.