Glass passivated or planar junction.
Excellent clamping capability.
Repetition rate (duty cycle): 0.01%.
Typical IR less than 2μA above 10V.
Low profile package and low inductance.
3000W Peak Pulse power capability at 10×1000μs waveform.
Fast response time: typically less than 1.0ps from 0V to VBR min.
High temperature soldering: 260°C/10s at terminals.
Plastic package has Underwriters Laboratory Flammability 94V-0.
Meets MSL level 1, per J-STD-020.
For surface mounted applications in order to optimize board space.