Glass passivated or planar junction. Low profile package and low inductance. Excellent clamping capability. Repetition rate(duty cycle): 0.01%. 600W Peak Pulse power capability at 10×1000μs waveform. Typical IR less than 1μA above 10V. Fast response time: typically less than 1.0ps from 0V to VBR min. High temperature soldering: 260°C/10s at terminals. Plastic package has underwriters laboratory flammability 94V-0. Meets MSL level 1, per J-STD-020. For surface mounted applications in order to optimize board space.