For surface mounted applications in order to optimize board space
Low profile package
Built-in strain relief
Glass passivated junction
Low inductance
Excellent clamping capability
Fast response time
Typical IR less than 2μA above 22V
High Temperature soldering: 260°C/10 seconds at terminals
Plastic package has underwriters laboratory flammability 94V-0
Meets MSL level 1, per J-STD-020
5000W peak pulse power capability at 10/1000μs waveform, repetition rate (duty cycle): 0.01%