Main Characteristics:Chip fuse; Time-Lag (T)
Standard:UL248-14
Approval:cURus
Materials
Substrate: Ceramic
Termination: Silver over-plated with nickel and tin
Operating Temperature:-55℃ to +150℃
Storage Conditions:+10℃ to +60℃
Relative humidity:≤75% yearly average
Without dew, maximum 30 days at 95%
Soldering Parameters
260℃.≤10 sec (Wave Soldering)
350℃.≤3 sec (Hand Soldering)
Soldering Peak:
260℃. 10 sec.
280℃. 5 sec.